| 2014-08-22 | Original language:English | PDF # 1 | 9.21 x.31 x6.14l,.0 | File Name: 3319076108 | 179 pages
||From the Back Cover||This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitan
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon...
[PDF.pr92] Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing) Rating: 4.87 (690 Votes)
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You easily download any file type for your gadget.Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing) | Khaled Salah, Yehea Ismail, Alaa El-Rouby. I have read it a couple of times and even shared with my family members. Really good. Couldnt put it down.
