[Mobile library] Carbon Nanotubes for Interconnects: Process, Design and Applications
·•●- From Springer ·•●-
| #7250488 in Books | 2016-07-09 | Original language:English | PDF # 1 | 9.21 x.81 x6.14l,.0 | File Name: 3319297449 | 333 pages
|||“It can be served as a single-source reference on carbon nanotubes (CNTs) for interconnects applications. … a valuable addition to a scientific library, as well as served as good introduction for CNTs in 3D IC integrations for semiconductor packa
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nano...
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You easily download any file type for your device.Carbon Nanotubes for Interconnects: Process, Design and Applications | From Springer. Which are the reasons I like to read books. Great story by a great author.
